Winbond - W538T808

From CPU Graveyard - Die shots

Winbond ViewTalk W538T808.jpg
General Specifications:
Manufacturer:
Type:
Family:
Sub-Family:
Part number:
W538T808
Die marking:
Core/Code/uArch:
Cores:
Die size:
5.00mm x 4.50mm
Transistors:
Technology:
?
Visible Layers:
Die photo links:
Tags: