Renesas - SH-MobileG1 (layout)

Renesas_-_SH-MobileG1_(layout)

General Specifications:

Manufacturer:

Renesas

Type:

SoC

Family:

Super-H

Sub-Family:

Part number:

Die marking:

Core/Code/uArch:

SH-X2,  ARM926EJ-S

Cores:

Die size:

11.15 x 11.15mm^2

Transistors:

181M

Technology:

90nm,  7Cu+1Al,  dual Vth

Visible Layers:

Die photo links:

(Image's page) (Full resolution) (Thumb)

Die photo license:

Copyright, Renesas

Die photo source:

https://old.hotchips.org...es/HC18.S8/HC18.S8T2.pdf

Tags:

layout

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