Intel - Pentium II (Deschutes) wire bonded

From CPU Graveyard - Die shots

General Specifications:
Manufacturer:
Type:
Family:
Sub-Family:
Part number:
Die marking:
Core/Code/uArch:
Cores:
Die size:
118mm^2
Transistors:
Technology:
Visible Layers:
Die photo links:
Die photo license:
unknown license,
Die photo source:
Notes:
wire bonded