IBM - POWER9 (layout)

IBM_-_POWER9_(layout)

General Specifications:

Manufacturer:

IBM

Type:

CPU

Family:

POWER

Sub-Family:

POWER9

Part number:

Die marking:

Core/Code/uArch:

POWER9 SMT4 + SMT8

Cores:

Die size:

Transistors:

8B

Technology:

14nm,  finFET,  17 metal layer

Visible Layers:

Die photo links:

(Image's page) (Full resolution) (Thumb)

Die photo license:

Copyright, IBM

Die photo source:

https://old.hotchips.org...R9-Thompto-IBM-final.pdf

Tags:

layout

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