HP - Hybrid Processor family
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Address-Extension Chip
General Specifications:
Part number:
AEC, 5061-3001
Die marking:
Die size:
Transistors:
?
Technology:
?
Visible Layers:
?
Die photo links:
(Image's page) (Full resolution) (Thumb)
Die photo license:
Die photo source:
Binary Processor Chip
General Specifications:
Part number:
BPC, 5061-3001
Die marking:
Core/Code/uArch:
Cores:
Die size:
Transistors:
?
Technology:
?
Visible Layers:
?
Die photo links:
(Image's page) (Full resolution) (Thumb)
Die photo license:
Die photo source:
Extended Math Chip
General Specifications:
Part number:
EMC, 5061-3001
Die marking:
Core/Code/uArch:
Cores:
Die size:
Transistors:
?
Technology:
?
Visible Layers:
?
Die photo links:
(Image's page) (Full resolution) (Thumb)
Die photo license:
Die photo source:
I/O Chip
General Specifications:
Part number:
IOC, 5061-3001
Die marking:
Core/Code/uArch:
Cores:
Die size:
Transistors:
?
Technology:
?
Visible Layers:
?
Die photo links:
(Image's page) (Full resolution) (Thumb)
Die photo license:
Die photo source:
