| Image |
Description
|
 |
Motorola - C6065P
Function: FM Multiplex Stereo Demodulator
Package: Zig-Zag Skinny Plastic Dual In-Line Package
Notes: Zig-Zag packages for standard 0.6" DIP are a little rare, but this is the first I saw for the skinny 0.3" DIP
|
 |
NEC - 00017-80013 9347H7
Function: unknown
Package: Tape Carrier Package
Notes: TCP were used in some Intel - Pentium laptop processors, and some Sun graphics cards. This one was pretty.
|
 |
HP - 1AA7-6002
Function: CPU-to-Hewlewtt-Packard-Interface-Bus (CHI)
Package:
Notes: During this era, HP made allot of unique and beautiful chips in white ceramic and gold.
|
 |
HP - A5061-3020
Function: Support chip for the HP Hybrid Processor [1] [2]
Package:
Notes: Another beautiful white ceramic and gold package by HP
|

 |
Raytheon - RC4194D
Function: Dual Tracking Voltage Regulators
Package: Skinny Ceramic Dual In-line Package
Notes: I've never seen chips that are topped/bottomed with silvery metal, sandwiching white ceramic
|
 |
Harris - HA1-2404-4
Function: Op-amp
Package: Gold topped/bottomed Skinny Ceramic Dual In-line Package
Notes: Notice how the end pins extend beyond the ceramic.
|
 |
RCA - 00 015 F12
Function:
Package: Bottom-Brazed Skinny Ceramic Dual In-line Page
Notes:
|
 |
Analog Devices - 40J
Function: Op-Amp
Package: 1" x 1" encapsulated plastic module
Notes: A large module that looks a part from a kids intro to electronics.
|
 |
IBM - 36L9420
Function: CPU terminator for Slot 1 socket
Package: Single Edge Contact Cartridge
|

 |
HP - HDSP-2301
Function: Four Character 5 x 7 Alphanumeric Displays
Package: Bottom-Brazed Dual In-line Package
Notes: 140 tiny LEDs for displaying 4 characters
|
 |
???
Function: ???
Package: Glob Top Encapsulation on PCB interposter with side contacts
Notes: Just neat
|
 |
ST - MKI48Z02B20
Function: Non-Volatile SRAM module
Package: Plastic Dual In-line Package with plastic block glued on top
Notes: It's RAM with a battery glued on top, so it never looses its memory.
|
 |
Western Electric - 6F261K
Function:
Package: Skinny Ceramic Dual In-line Package
Notes:
|
 |
Western Electric - 6G243D
Function:
Package: Skinny Plastic Dual In-line Package
Notes: I've never seen a green package. White, black, gray, brown, purple, tan but not green
|
 |
??? - NE161J
Function: ???
Package: flatpack
Notes: A very early military chip package. The part number printing is offset
|


 |
Unknown flatpack in a module
Package: Flatpack
Notes: There is a white and black one, both with a gold plate on the back.
|
 |
IBM - unknown chip
Package: Pin Grid Array(PGA) with metal lid removed
Notes: Just cool traces from dir to pins.
|
 |
Notes: This isn't a IC package, it is a bypass capacitor that is soldered directly on top of a DIP. This give the shortest route from Vcc and GND to the capacitor. I've only seen this once.
|