Chip packages
From CPU Grave Yard
In-line Package - DIP / SIP / QIP / ZIP
| Type | Acronym | Definition |
|---|---|---|
| DIP | BBDIP-H | Bottom-Brazed Dual In-line Package, Hybrid |
| DIP | CerDIP | Glass-Sealed, Ceramic, Dual In-line Package |
| DIP | CDIP | Ceramic, Dual In-line Package |
| DIP | BBDIP/CDIP-BB | Bottom-Braze, Ceramic, Dual In-line Package |
| ZIP | CZIP | Ceramic, Zig-zag In-line Package |
| DIP | DIP | Dual In-line Package |
| DIP | DIP-tab | Dual In-line Package, with metal Heatsink(tab) |
| DIP | DIPH | Dual In-line Package, with head-spreader |
| DIP | FDIP | (windowed) Frit-seal Dual In-line Package |
| DIP | HEXDIP/HexDIP | (4 pin plastic) Dual In-line Package |
| DIP | MDIP | Molded Dual In-line Package |
| ZIP | PZIP | Plastic, Zig-zag In-line Package |
| QIP | QIP/QIL | Quad In-line Package |
| QIP | QUIP | QUad In-line Package |
| DIP | SBDIP-H | Side-Brazed, Dual In-line, Hybrid |
| DIP | SBDIP/SBCDIP/CDIP-SB/SD | Side-Brazed, Ceramic, Dual In-line Package |
| DIP | TBDIP/TBCDIP/CDIP-TB/TD | Top-Brazed, Ceramic, Dual In-line Package |
| DIP | SCDIP | Skinny, Ceramic Dual In-line Package |
| DIP | SDIP | Skinny, Dual In-line Package |
| DIP | SDIPH | Shrink, Dual In-line Package, Head-spreader |
| SIP | SIP/SIL | Single In-line Package |
| SIP | SIPH | Single In-line package, Heatsink |
| SIP | SIPP | Single-In-line Pin Package |
| DIP | SMDIP | Surface Mount, Dual In-line |
| DIP | SPDIP | Shrink, Plastic, Dual In-line package |
| DIP | SPDIP | Skinny, Plastic Dual In-line Package |
| ZIP | ZIP | Zig-zag In-line Package |
| ZIP | PZIP | Plastic, Zig-zag In-line Package |
| ZIP | ZIPH | Zig-zag In-line Package, with Heat-spreader |
Leadless - DFN / QFN / SON / LeadFrame
| Type | Acronym | Definition |
|---|---|---|
| QFN | BQFN | Ball grid array, Quad Flat No-lead |
| QFN | DHVQFN/DQFN | Depopulated, Heatsink, Very-thin, Quad Flat No-lead |
| QFN | DQFN/DRQFN/QFN-dr | Dual-Row, Quad Flat No-lead |
| QFN | HVQFN | Heat-spreader, Very thin Quad Flat No-lead |
| QFN | LQFN | Low profile, Quad Flat No-lead |
| QFN | MRQFN | Multi-Row Quad Flat No-lead |
| QFN | OmQFN | Open-molded, Quad Flat No-lead |
| QFN | P-VQFN | Plastic, Very-Thin, Quad Flat No-lead |
| QFN | PQFN/P-QFN | Power, Quad Flat No-lead |
| QFN | QFN | Quad Flat No-lead |
| QFN | QFN-TEP | Quad Flat No-lead, with Top-Exposed Pad |
| QFN | QFNp | Quad Flat No-lead, Punch |
| QFN | QFNs | Quad Flat No-lead, Sawn |
| QFN | TQFN | Thin, Quad Flat No-lead |
| QFN | UQFN | Ultra-thin, Quad Flat No-lead |
| QFN | VQFN | Very-thin, Quad Flat No-lead 0.5mm pitch |
| QFN | VQFN/WQFN | Very-thin, Quad Flat No-lead |
| QFN | VQFNP | Very-thin, Quad Flat No-lead, Fine-pitch |
| QFN | WQFN | Very-very-thin, Quad Flat No-leads |
| QFN | XQFN | eXtremely thin, quad flat No-lead |
| DFN | DFN | Dual Flatpack No Lead, AKA SON |
| SON | SON | Small Outline No-lead, AKA DFN |
| DFN | TDFN | Thin, Dual Flat No-lead |
| DFN | UDFN/UTDFN | Ultra-thin, Dual Flat No-lead |
| DFN | XDFN | eXtremely thin, dual flat No-lead |
| SON | LSON | Leadless Small Outline No-lead |
| SON | SON | Small Outline No-lead, AKA DFN |
| SON | USON | Ultra-thin, Small Outline No-lead |
| SON | VSON | Very-thin, Small Outline No-lead |
| SON | VSONP | Very-thin, Small Outline No-lead, with thermal Pad |
| SON | WSON | Wafer-scale Small Outline No-leads |
| Leadframe | DRMLF | Dual-Row, Micro LeadFrame |
| Leadframe | MLPD | Micro-Leadframe Package, Dual |
| Leadframe | MLPM | Micro-Leadframe Package, Micro |
| Leadframe | MLF/MLPQ | Micro-Leadframe Package, Quad |
| Leadframe | DLLP | Leadless Leadframe Package |
| LCC | LPCC | Leadless, Plastic, Chip Carrier |
Ball Grid Array - BGA / CSP
| Type | Acronym | Definition |
|---|---|---|
| BGA | BGA | Ball Grid Array |
| BGA | CABGA | Chip-Array, Ball Grid Array |
| BGA | CBGA | Ceramic Ball Grid Array |
| BGA | CDTBGA | Cavity Down, Tape, Ball Grid Array |
| BGA | CFCBGA | Ceramic, Flip-Chip, Ball Grid Array |
| BGA | CMBGA | Ceramic, Mini, Ball Grid Array |
| BGA | CSBGA | Chip Size, Ball Grid Array |
| BGA | CSPBGA | Chip Scale Package, Ball Grid Array |
| BGA | CTBGA | Chip array, Thin core, Ball Grid Array |
| BGA | CVBGA | Chip array, Very-thin, Ball Grid Array |
| BGA | D2BGA | Die Dimension, Ball Grid Array |
| BGA | DBGA | Dimpled, Ball Grid Array |
| BGA | DSBGA | Die Size, Ball Grid Array, AKA WCSP |
| BGA | DSBGA | Die-Size, Ball Grid Array |
| BGA | EBGA | (thermally) Enhanced, Ball Grid Array |
| BGA | EDHS-BGA | Exposed, Drop-In, Heat Sink, Ball Grid Array |
| BGA | FBGA | Fine, Ball Grid Array |
| BGA | FC-PBGA | Flip-Chip, Plastic, Ball Grid Array |
| BGA | FCBGA | Flip-Chip, Ball Grid Array |
| BGA | FCmBGA | Flip-Chip, Molded, Ball Grid Array |
| BGA | HBGA | Heat-spreader, Ball Grid Array |
| BGA | HBGA | High power, Ball Grid Array |
| BGA | HP-fcBGA | High Performance, Flip-Chip, Ball Grid Array |
| BGA | HPBGA | High Performance, Ball Grid Array |
| BGA | HSBGA | Heat-Spreader, Ball Grid Array |
| BGA | L2BGA | Laser Laminated, Ball Grid Array |
| BGA | LBGA | Laminate, Ball Grid Array |
| BGA | LBGA | Low-profile, Ball Grid Array |
| BGA | LCBGA | Low Cost, Ball Grid Array |
| BGA | LFBGA | Low profile, Fine pitch, Ball Grid Array |
| BGA | LTBGA | Low-profile, Tape, Ball Grid Array |
| BGA | M2BGA | Mitsui Mini, Ball Grid Array |
| BGA | MBGA | Metal (substraight), Ball Grid Array |
| BGA | MBGA | Micro, Ball Grid Array |
| BGA | MCBGA | Multi-Chip, Ball Grid Array |
| BGA | MCM-CBGA | Multi-Chip Module, Ceramic Ball Grid Array |
| BGA | MCM-PBGA | Multi-Chip Module, Plastic Ball Grid Array |
| BGA | MPBGA | Multi-Package, Ball Grid Array |
| BGA | NFBGA | New, Fine-pitch, Ball Grid Array |
| BGA | PBGA | Plastic, Ball Grid Array |
| BGA | PFBGA | Plastic, Fine Pitch, Ball Grid Array |
| BGA | POP-BGA | Package On Package, Ball Grid Array |
| BGA | SBGA | Spreader, Ball Grid Array |
| BGA | SG-FCLBGA | Silicon-Green, Flip-Chip, Low-profile, Ball Grid Array |
| BGA | STFBGA | Stacked, Thin-profile, Fine-pitch, Ball Grid Array |
| BGA | SVFBGA | Stacked, Very-thin, Fine-pitch, Ball Grid Array |
| BGA | SuperBGA/SBGA | Super, Ball Grid Array |
| BGA | TABGA | TapeArray, Ball Grid Array |
| BGA | TBGA | Tape, Ball Grid Array |
| BGA | TBGA | Thin, Ball Grid Array |
| BGA | TEPBGA | Thermally Enhanced, Plastic, Ball Grid Array |
| BGA | TFBGA | Thin-profile, Fine-pitch, Ball Grid Array |
| BGA | TFTBGA | Thin-profile, Fine-pitch, Tape, Ball Grid Array |
| BGA | UBGA | Ultra-thin, Ball Grid Array |
| BGA | UFBGA/UBGA | Ultra Fine, Ball Grid Array |
| BGA | VBGA | Very-thin, profile, Ball Grid Array |
| BGA | VFBGA | Very-Fine pitch, Ball Grid Array |
| BGA | WCSP | Wafer Chip Scale Package, AKA DSBGA |
| BGA | WFBGA | Wafer-Level, Fine-Pitch, Ball Grid Array |
| BGA | XP-fcBGA | eXtra Performance, Flip-Chip, Ball Grid Array |
| BGA | fcLBGA | Flip-Chip, Low-profile, Ball Grid Array |
| BGA | nFBGA | New, Fine Pitch, Ball Grid Array |
| BGA | μBGA/uBGA/MBGA | Micro, Ball Grid Array |
| BGA | μFCBGA/uFCBGA | Micro, Flip-Chip, Ball Grid Array |
| BGA | MAP-BGA | Mold Array Process – Ball-Grid Array |
| CSP | CSP/CS | Chip Scale Package |
| CSP | CSPBGA | Chip Scale Package, Ball Grid Array |
| CSP | DSBGA | Die Size, Ball Grid Array, AKA WCSP |
| CSP | FCCSP | Flip-Chip, Chip Scale Package |
| CSP | LFCSP | LeadFrame, Chip Scale Package |
| CSP | W-CSP/WLCSP | Wafer-level, Chip Scale Package |
| CSP | WCSP | Wafer Chip Scale Package, AKA DSBGA |
| CSP | µCSP/uCSP | Micro, Chip Scale Package |
