Chip packages

Image	Lead Type	Description	Example packages
	I-Lead	A straight lead that extend from the packages sides	Flatpack, CerQUAD
	J-Lead	A J-shaped lead that wraps around the side of the package	PLCC, SOJ
File:CABGA-package.jpg	Ball	Solder or metal balls in a grid pattern	BGA, CSP
File:SMDIP-chip-package.webp	Gull-Wing	Curved pin attached to side	SOIC, SOP, QFP
File:CFCBGA-package.png	Land/Pad	Usually square or circle flat contacts on the bottom in a grid pattern	LGA, QFN, SON
	Thru-Hole	Pin going straight down from side in rows	DIP, SIP, ZIP
	Pin(PGA)	Strait pin/column from bottom in grid pattern	PGA, CGA
[[file:|100px]]
[[file:|100px]]
[[file:|100px]]

Butt? C L-Lead Stub Bent Coplanarity flat? one UIC

In-line Package - DIP / SIP / QIP / ZIP

Common Prefixes/Suffixes

• P - Plastic
• C - Ceramic
• H - Heatsink/Heat-speader, thermally enhanced
• S/SK - Skinny (0.3" width)
• S/SH/SHR - Shrink (pitch)

Acronyms

Type	Acronym	Definition
DIP	BBDIP-H	Bottom-Brazed Dual In-line Package, Hybrid
DIP	CerDIP	Glass-Sealed, Ceramic, Dual In-line Package
DIP	CDIP	Ceramic, Dual In-line Package
DIP	BBDIP/CDIP-BB	Bottom-Braze, Ceramic, Dual In-line Package
ZIP	CZIP	Ceramic, Zig-zag In-line Package
DIP	DIP	Dual In-line Package
DIP	DIP-tab	Dual In-line Package, with metal Heatsink(tab)
DIP	DIPH	Dual In-line Package, with head-spreader
DIP	FDIP	(windowed) Frit-seal Dual In-line Package
DIP	HEXDIP/HexDIP	(4 pin plastic) Dual In-line Package
DIP	MDIP	Molded Dual In-line Package
ZIP	PZIP	Plastic, Zig-zag In-line Package
QIP	QIP/QIL	Quad In-line Package
QIP	QUIP	QUad In-line Package
DIP	SBDIP-H	Side-Brazed, Dual In-line, Hybrid
DIP	SBDIP/SBCDIP/CDIP-SB/SD	Side-Brazed, Ceramic, Dual In-line Package
DIP	TBDIP/TBCDIP/CDIP-TB/TD	Top-Brazed, Ceramic, Dual In-line Package
DIP	SCDIP	Skinny, Ceramic Dual In-line Package
DIP	SDIP	Skinny, Dual In-line Package
DIP	SDIPH	Shrink, Dual In-line Package, Head-spreader
SIP	SIP/SIL	Single In-line Package
SIP	SIPH	Single In-line package, Heatsink
SIP	SIPP	Single-In-line Pin Package
DIP	SMDIP	Surface Mount, Dual In-line
DIP	SPDIP	Shrink, Plastic, Dual In-line package
DIP	SPDIP	Skinny, Plastic Dual In-line Package
ZIP	ZIP	Zig-zag In-line Package
ZIP	PZIP	Plastic, Zig-zag In-line Package
ZIP	ZIPH	Zig-zag In-line Package, with Heat-spreader

Leadless - DFN / QFN / SON / LeadFrame

Common Prefixes/Suffixes

• P - Plastic
• C - Ceramic
• H - Heatsink/Heat-speader, thermally enhanced
• T - Thin profile
• V - Very thin profile
• W - Very very thin profile
• U - Ultra thin profile

Acronyms

Type	Acronym	Definition
QFN	BQFN	Ball grid array, Quad Flat No-lead
QFN	DHVQFN/DQFN	Depopulated, Heatsink, Very-thin, Quad Flat No-lead
QFN	DQFN/DRQFN/QFN-dr	Dual-Row, Quad Flat No-lead
QFN	HVQFN	Heat-spreader, Very thin Quad Flat No-lead
QFN	LQFN	Low profile, Quad Flat No-lead
QFN	MRQFN	Multi-Row Quad Flat No-lead
QFN	OmQFN	Open-molded, Quad Flat No-lead
QFN	P-VQFN	Plastic, Very-Thin, Quad Flat No-lead
QFN	PQFN/P-QFN	Power, Quad Flat No-lead
QFN	QFN	Quad Flat No-lead
QFN	QFN-TEP	Quad Flat No-lead, with Top-Exposed Pad
QFN	QFNp	Quad Flat No-lead, Punch
QFN	QFNs	Quad Flat No-lead, Sawn
QFN	TQFN	Thin, Quad Flat No-lead
QFN	UQFN	Ultra-thin, Quad Flat No-lead
QFN	VQFN	Very-thin, Quad Flat No-lead 0.5mm pitch
QFN	VQFN/WQFN	Very-thin, Quad Flat No-lead
QFN	VQFNP	Very-thin, Quad Flat No-lead, Fine-pitch
QFN	WQFN	Very-very-thin, Quad Flat No-leads
QFN	XQFN	eXtremely thin, quad flat No-lead
DFN	DFN	Dual Flatpack No Lead, AKA SON
SON	SON	Small Outline No-lead, AKA DFN
DFN	TDFN	Thin, Dual Flat No-lead
DFN	UDFN/UTDFN	Ultra-thin, Dual Flat No-lead
DFN	XDFN	eXtremely thin, dual flat No-lead
SON	LSON	Leadless Small Outline No-lead
SON	SON	Small Outline No-lead, AKA DFN
SON	USON	Ultra-thin, Small Outline No-lead
SON	VSON	Very-thin, Small Outline No-lead
SON	VSONP	Very-thin, Small Outline No-lead, with thermal Pad
SON	WSON	Wafer-scale Small Outline No-leads
Leadframe	DRMLF	Dual-Row, Micro LeadFrame
Leadframe	MLPD	Micro-Leadframe Package, Dual
Leadframe	MLPM	Micro-Leadframe Package, Micro
Leadframe	MLF/MLPQ	Micro-Leadframe Package, Quad
Leadframe	DLLP	Leadless Leadframe Package
LCC	LPCC	Leadless, Plastic, Chip Carrier

Ball Grid Array - BGA / CSP

Common Prefixes/Suffixes

• P - Plastic
• C - Ceramic
• H/HS/E/TE - Heatsink/Heat-speader, Thermally Enhanced
• T - Thin profile
• V - Very thin profile
• VF - Very Fine pitch
• W - Very very thin profile
• U - Ultra thin profile
• UF - Ultra Fine pitch
• F - Fine pitch
• μ/M - micro
• FC - Flip-Chip

Acronyms

Type	Acronym	Definition
BGA	BGA	Ball Grid Array
BGA	CABGA	Chip-Array, Ball Grid Array
BGA	CBGA	Ceramic Ball Grid Array
BGA	CDTBGA	Cavity Down, Tape, Ball Grid Array
BGA	CFCBGA	Ceramic, Flip-Chip, Ball Grid Array
BGA	CMBGA	Ceramic, Mini, Ball Grid Array
BGA	CSBGA	Chip Size, Ball Grid Array
BGA	CSPBGA	Chip Scale Package, Ball Grid Array
BGA	CTBGA	Chip array, Thin core, Ball Grid Array
BGA	CVBGA	Chip array, Very-thin, Ball Grid Array
BGA	D2BGA	Die Dimension, Ball Grid Array
BGA	DBGA	Dimpled, Ball Grid Array
BGA	DSBGA	Die Size, Ball Grid Array, AKA WCSP
BGA	DSBGA	Die-Size, Ball Grid Array
BGA	EBGA	(thermally) Enhanced, Ball Grid Array
BGA	EDHS-BGA	Exposed, Drop-In, Heat Sink, Ball Grid Array
BGA	FBGA	Fine, Ball Grid Array
BGA	FC-PBGA	Flip-Chip, Plastic, Ball Grid Array
BGA	FCBGA	Flip-Chip, Ball Grid Array
BGA	FCmBGA	Flip-Chip, Molded, Ball Grid Array
BGA	HBGA	Heat-spreader, Ball Grid Array
BGA	HBGA	High power, Ball Grid Array
BGA	HP-fcBGA	High Performance, Flip-Chip, Ball Grid Array
BGA	HPBGA	High Performance, Ball Grid Array
BGA	HSBGA	Heat-Spreader, Ball Grid Array
BGA	L2BGA	Laser Laminated, Ball Grid Array
BGA	LBGA	Laminate, Ball Grid Array
BGA	LBGA	Low-profile, Ball Grid Array
BGA	LCBGA	Low Cost, Ball Grid Array
BGA	LFBGA	Low profile, Fine pitch, Ball Grid Array
BGA	LTBGA	Low-profile, Tape, Ball Grid Array
BGA	M2BGA	Mitsui Mini, Ball Grid Array
BGA	MBGA	Metal (substraight), Ball Grid Array
BGA	MBGA	Micro, Ball Grid Array
BGA	MCBGA	Multi-Chip, Ball Grid Array
BGA	MCM-CBGA	Multi-Chip Module, Ceramic Ball Grid Array
BGA	MCM-PBGA	Multi-Chip Module, Plastic Ball Grid Array
BGA	MPBGA	Multi-Package, Ball Grid Array
BGA	NFBGA	New, Fine-pitch, Ball Grid Array
BGA	PBGA	Plastic, Ball Grid Array
BGA	PFBGA	Plastic, Fine Pitch, Ball Grid Array
BGA	POP-BGA	Package On Package, Ball Grid Array
BGA	SBGA	Spreader, Ball Grid Array
BGA	SG-FCLBGA	Silicon-Green, Flip-Chip, Low-profile, Ball Grid Array
BGA	STFBGA	Stacked, Thin-profile, Fine-pitch, Ball Grid Array
BGA	SVFBGA	Stacked, Very-thin, Fine-pitch, Ball Grid Array
BGA	SuperBGA/SBGA	Super, Ball Grid Array
BGA	TABGA	TapeArray, Ball Grid Array
BGA	TBGA	Tape, Ball Grid Array
BGA	TBGA	Thin, Ball Grid Array
BGA	TEPBGA	Thermally Enhanced, Plastic, Ball Grid Array
BGA	TFBGA	Thin-profile, Fine-pitch, Ball Grid Array
BGA	TFTBGA	Thin-profile, Fine-pitch, Tape, Ball Grid Array
BGA	UBGA	Ultra-thin, Ball Grid Array
BGA	UFBGA/UBGA	Ultra Fine, Ball Grid Array
BGA	VBGA	Very-thin, profile, Ball Grid Array
BGA	VFBGA	Very-Fine pitch, Ball Grid Array
BGA	WCSP	Wafer Chip Scale Package, AKA DSBGA
BGA	WFBGA	Wafer-Level, Fine-Pitch, Ball Grid Array
BGA	XP-fcBGA	eXtra Performance, Flip-Chip, Ball Grid Array
BGA	fcLBGA	Flip-Chip, Low-profile, Ball Grid Array
BGA	nFBGA	New, Fine Pitch, Ball Grid Array
BGA	μBGA/uBGA/MBGA	Micro, Ball Grid Array
BGA	μFCBGA/uFCBGA	Micro, Flip-Chip, Ball Grid Array
BGA	MAP-BGA	Mold Array Process – Ball-Grid Array
CSP	CSP/CS	Chip Scale Package
CSP	CSPBGA	Chip Scale Package, Ball Grid Array
CSP	DSBGA	Die Size, Ball Grid Array, AKA WCSP
CSP	FCCSP	Flip-Chip, Chip Scale Package
CSP	LFCSP	LeadFrame, Chip Scale Package
CSP	W-CSP/WLCSP	Wafer-level, Chip Scale Package
CSP	WCSP	Wafer Chip Scale Package, AKA DSBGA
CSP	µCSP/uCSP	Micro, Chip Scale Package

References

• https://manual.dexpcb.com/integrated-circuits.htm
• Kynix - Comprehensive Analysis of IC Packaging Packages Types
• MAD - All about Active, Passive and Electromechanical Components
• TopLine - Surface Mount Nomenclature and Packaging
• mbedded.ninja - Component Packages
• JEDEC Standard - Descriptive Designation System for Semiconductor-Device Packages
• IPC-7351B Naming Convention for Surface Mount Device 3D Models and Footprints
• Lead types
• Transistor/Diode Packages (ru)
• [https://www.mouser.com/pdfDocs/central-semiconductor_package_types.pdf Central Semiconductors - Surface Mount & Through-hole

Package]

• EESEMI - IC Package Types
• Package List (ru)
• List of Diode Packages
• PCD Libraries: (Naming Conventions) Electronic Component CAD Library) Good images, list of packages, nomenclature.
• JEDEC: (TRANSISTORS OUTLINES (TO)) DIODE OUTLINES (DO) MICROELECTRONIC OUTLINES (MO) MICROELECTRONIC STANDARDS (MS)
• TopLine - Catalog
• Nasa - QFN Book of Knowledge

3D

• Understand CoWoS, HBM, and FOWLP: A Beginner-Friendly Semiconductor Keyword Map
• [https://www.hc33.hotchips.org/assets/program/tutorials/2021%20HotChips%20TSMC%20Packaging%20Technologies%20for%20Chiplets%20and%203D_0819%20publish_public.pdf TSMC

Packaging Technologies for Chiplets and 3D]

Manufacturers

• Toshiba - Packages
• NXP - Packages
• Analog Devices - Packages
• Infineon - Infineon Discrete Packages without Leads
• Mitsumi (list)
• Infineon - Package
• Diodes (automotive)
• Hitachi Semiconductor Package Guide
• Maxim/Analog - List of Packages
• Maxim Integrated - Package - Information Archived Nov 2021
• Dallas - List of Packages
• TI - Hermetic Packages (SMT)
• Microchip - PACKAGE QUALIFICATION SUMMARY REPORT, list of packages
• On-Semi - Packages list
• Richtek - Package Outlines
• Rohm - Package List (good images)
  • Rohm IC Packages
• Communications Equipment ICs (ASSPs) (list of packages)